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InfiniBand Interconnects

1.6T OSFP224 2xFR4H 2km Transceiver | OSFP-1.6T-2xFR4H / 980-9IAS0-00XM00

Catalog reference: NVIDIA/Mellanox Coding Target MMS4A50-XM (980-9IAS0-00XM00) Compatible 1.6T 2xFR4 OSFP224 IHS/Closed Finned Top 8x200G PAM4 Broadcom 3nm DSP (Sian3| BCM83628) 1310nm 2km SMF DOM Dual LC Duplex InfiniBand XDR Optical Transceiver Module for Quantum-X800 Air-Cooled Switches

The part numbers on this page identify the requested coding target. Confirm the exact host model, port and firmware for the selected SKU.

NVIDIA/Mellanox Coding Target MMS4A50-XM (980-9IAS0-00XM00) is a 1.6T 2x800Gb/s Twin-port OSFP, 2xFR4 single mode, multiplexed, 8-channel transceiver using two, 2-fiber, LC Duplex optical connectors each carrying 4-channels of 200G-PAM4. Powered by Broadcom 3nm DSP (Sian3| BCM83628) and self-developed silicon photonics chips, it is designed to link NVIDIA Quantum-X800 air-cooled switches.

Family osfp-1-6t-2xfr4h-102790Model OSFP-1.6T-2xFR4H1 SKU option

Requested part-number references

Requested coding target
NVIDIA/Mellanox
Primary reference identifier
980-9IAS0-00XM00

Part-number identifiers and aliases available for matching:

  • 980-9IAS0-00XM00
  • MMS4A50-XM

Review boundary: These identifiers reproduce source catalog matching terms only; they do not establish interoperability, approval or endorsement. Confirm the exact host model, port type, firmware and test evidence before use.

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SKU 102790 - Model OSFP-1.6T-2xFR4H

NVIDIA/Mellanox Coding Target MMS4A50-XM (980-9IAS0-00XM00) Compatible 1.6T OSFP224 2xFR4 IHS/Closed Finned Top InfiniBand XDR SMF Transceiver for Quantum-X800 Air-Cooled Switches

NVIDIA/Mellanox Coding Target MMS4A50-XM (980-9IAS0-00XM00) is a 1.6T 2x800Gb/s Twin-port OSFP, 2xFR4 single mode, multiplexed, 8-channel transceiver using two, 2-fiber, LC Duplex optical connectors each carrying 4-channels of 200G-PAM4. Powered by Broadcom 3nm DSP (Sian3| BCM83628) and self-developed silicon photonics chips, it is designed to link NVIDIA Quantum-X800 air-cooled switches.

BrandSUNFULL
Compatible brand / platformInfiniBand platform (vendor not specified)
Chip SolutionsBroadcom Sian3| BCM83628

Use this selection as the requested coding target. Final compatibility still requires the host model, port type and firmware version.

Product brand: SUNFULL. Third-party names identify requested compatibility or coding targets only and do not imply affiliation, endorsement or original-equipment status.

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  • Built-in Broadcom 3nm DSP (Sian3 BCM83628) and self-developed silicon photonics chips.
  • Maximum power consumption is 26W.
  • 8x200G-PAM4 electrical modulation.
  • Compliant with OSFP MSA, IEEE 802.3dj_D1.1 protocol, and CMIS 5.2.

Engineering record

Specifications

Family-level values from the collected technical record. Confirm the selected SKU and required evidence in the quotation.

Form Factor
OSFP224
Distance
2km
Wavelength
1310nm
Connector
Dual LC Duplex
Power Consumption
≤26W
Transmitter
CWDM SiPh MZM
Receiver
PIN
Media
SMF
Modulation (Electrical)
8x212Gb/s PAM4
Modulation (Optical)
Two ports 4x212Gb/s PAM4
Case Temperature (℃)
0 to 70°C (32 to 158°F)
Protocol
IB XDR, 1.6T Ethernet Compliant

Technical detail

Construction and application notes for OSFP-1.6T-2xFR4H

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Interface and construction

The 1.6T 2xFR4 transceiver integrates a Broadcom 3nm DSP (BCM83628), in-house silicon photonics, an LC interface, and a Closed-Top housing to optimize performance, reliability, and deployment efficiency. Compared with 5nm solutions, it reduces power consumption by over 20%, lowering thermal load while ensuring stable 2 km transmission. The LC interface simplifies deployment and maintenance through seamless integration with existing fiber infrastructure, while the Closed-Top housing improves thermal performance and suppresses EMI for reliable operation in high-density AI clusters.

Application and routing

As NVIDIA B300 clusters continue to scale, GPU fabrics are evolving toward higher-density, larger-scale deployments, making inter-building connectivity an increasingly important requirement for large-scale AI infrastructures. Designed for B300 cluster deployments, the 1.6T 2xFR4 transceiver provides up to 2 km FR connectivity and features dual LC interfaces to simplify on-site cabling and link management, reducing system-level cabling complexity while enabling more efficient large-scale deployment and operations, and protecting long-term infrastructure investment.

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Technical documents

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