NVIDIA/Mellanox | O2O112-800G-AE3H | Interconnect
800G OSFP to 2xOSFP 3–7m Interconnect with 5 exact SKU options. Confirm the host, port and firmware before quotation.
InfiniBand Interconnects
Catalog reference: 3m (10ft) NVIDIA/Mellanox Compatible 1.6T AEC OSFP224 IHS/Finned Top 8x200G PAM4 to OSFP224 IHS/Finned Top 8x200G PAM4 InfiniBand XDR Active Electrical Cable
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NVIDIA/Mellanox Compatible 3m (10ft) Twin-Port 2x800Gb/s OSFP224 IHS/Finned Top to 2x800Gb/s OSFP224 IHS/Finned Top Active Electrical Cable (AEC) is designed for InfiniBand XDR networking. It enables seamless high-speed interconnections between NVIDIA Quantum-X800 switches,offering greater flexibility than DACs for easier high-density cabling.
No OEM part-number alias was captured in the source record.
Review boundary: These identifiers reproduce source catalog matching terms only; they do not establish interoperability, approval or endorsement. Confirm the exact host model, port type, firmware and test evidence before use.
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NVIDIA/Mellanox Compatible 3m (10ft) InfiniBand XDR Twin-port 2x800Gb/s OSFP224 IHS/Finned Top to 2x800Gb/s OSFP224 IHS/Finned Top Active Electrical Cable (AEC)
NVIDIA/Mellanox Compatible 3m (10ft) Twin-Port 2x800Gb/s OSFP224 IHS/Finned Top to 2x800Gb/s OSFP224 IHS/Finned Top Active Electrical Cable (AEC) is designed for InfiniBand XDR networking. It enables seamless high-speed interconnections between NVIDIA Quantum-X800 switches,offering greater flexibility than DACs for easier high-density cabling.
Use this selection as the requested coding target. Final compatibility still requires the host model, port type and firmware version.
Product brand: SUNFULL. Third-party names identify requested compatibility or coding targets only and do not imply affiliation, endorsement or original-equipment status.
Engineering record
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Technical detail
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In high-density AI clusters, short- and medium-reach interconnects must balance performance, cabling flexibility, and cost. 1.6T AEC adopts a 30AWG thin-gauge design to improve routing flexibility and thermal performance, while integrating the Marvell 5nm DSP for high-speed, stable transmission. It also simplifies deployment and maintenance to reduce TCO, delivering a balanced, efficient interconnect solution for AI clusters
In high-density GPU clusters represented by NVIDIA B300, demand for short- and medium-reach interconnects between Leaf-to-Spine layers continues to grow, covering connections within racks and between adjacent racks. As GPU scale and link density continue to increase, networks require higher link stability under full-load operation. For this scenario, 1.6T AEC supports up to 3 meters of reach, fully meeting rack-level interconnect requirements. Its integrated design reduces connection complexity in high-density environments. With excellent signal integrity and low power consumption, it ensures consistent link performance under full-load operation.

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Compare alternatives
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