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RoCE Ethernet Interconnects

800G Twin-port OSFP 2xFR4 2km Transceiver | OSFP-800G-2xFR4 / MMS4X50-NM

Catalog reference: NVIDIA/Mellanox Coding Target MMS4X50-NM (980-9I30L-00N000) Compatible 800GBASE-2xFR4 OSFP IHS/Finned Top 8x100G PAM4 Broadcom DSP 1310nm 2km SMF DOM Dual LC Duplex Optical Transceiver Module for SN5610 Series Switch

The part numbers on this page identify the requested coding target. Confirm the exact host model, port and firmware for the selected SKU.

NVIDIA/Mellanox Compatible OSFP-800G-2FR4 optical transceiver are designed for data center 800G Ethernet 1310nm links reach up to 2km over 8 pairs of parallel SMF with FEC.

Family osfp-800g-2xfr4-32800Model OSFP-800G-2xFR46 SKU options

Requested part-number references

Requested coding target
NVIDIA/Mellanox
Primary reference identifier
MMS4X50-NM

Part-number identifiers and aliases available for matching:

  • MMS4X50-NM
  • 980-9I30L-00N000

Review boundary: These identifiers reproduce source catalog matching terms only; they do not establish interoperability, approval or endorsement. Confirm the exact host model, port type, firmware and test evidence before use.

Select the exact SKU

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SKU 102724 - Model OSFP-800G-2xFR4

NVIDIA/Mellanox Coding Target MMS4X50-NM Compatible 800G OSFP 2xFR4/FR8 PAM4 CWDM4 1310nm 2km Optical Transceiver

NVIDIA/Mellanox Compatible OSFP-800G-2FR4 optical transceiver are designed for data center 800G Ethernet 1310nm links reach up to 2km over 8 pairs of parallel SMF with FEC.

BrandSUNFULL
Compatible brand / platformNVIDIA/Mellanox (Ethernet)

Use this selection as the requested coding target. Final compatibility still requires the host model, port type and firmware version.

Product brand: SUNFULL. Third-party names identify requested compatibility or coding targets only and do not imply affiliation, endorsement or original-equipment status.

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  • Built-in Broadcom DSP Chip, Max Power Consumption ≤16W.
  • Compliant with Hot Pluggable OSFP MSA, IEEE802.3ck Standard.
  • Class1/1M Standard Product, Compliant with RoHS Environmental Protection Standards (Lead-Free).
  • DDM(Digital Diagnostic Monitoring) Supported.

Engineering record

Specifications

Family-level values from the collected technical record. Confirm the selected SKU and required evidence in the quotation.

Form Factor
Twin-port OSFP
Distance
2km
Wavelength
1310nm
Connector
Dual Duplex LC
Power Consumption
≤16W
Transmitter
EML
Receiver
PIN
Media
SMF
Modulation (electrical )
8x106.25Gb/s PAM4
Modulation (Optical )
8x106.25Gb/s PAM4
Case Temperature(℃)
0 to 70°C (32 to 158°F)
Protocol
800G Ethernet Compliant

Technical detail

Construction and application notes for OSFP-800G-2xFR4

Review connector, construction, routing and handling details that apply to the selected family and exact SKU.

Interface and construction

As the first FR single-mode transceiver released in the market, OSFP 800G 2xFR4 break through distance limitations in hyperscale data centers and adopt superior manufacturing process to deliver reliable performance of long-distance data transmission. The utilization of Broadcom DSP chip, advanced high-speed packaging technology, nanometer-level precision alignment of optical components, and optimized PCB design and assembly can reduce signal loss and crosstalk to ensure signal integrity and accurate data transmission and reception. The CWDM4 multi-wavelength optical multiplexing technology and optical coupling, together with efficient heat-dissipation thermal management, make the 800G 2xFR4 transceivers achieve multi-channel data transmission and maintain low power consumption & stable operation.

Application and routing

OSFP 800G 2xFR4 provides a cost-optimized, scenario-based connectivity solution for data centers. Utilizing DACs for efficient short-distance intra-rack connections reduces the need for intermediary devices and costs. For inter-rack transmissions, a module and patch cable approach ensures stable, high-speed data transmission. The flexible deployment solution balances performance and costs across varying transmission distances, effectively lowering the total cost of ownership (TCO) and deployment complexity. It offers a high-performance, cost-effective interconnect solution suitable for all scales of architecture, accelerating the efficient deployment and optimization of AI clusters.

Downloads

Technical documents

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